MediaTek has announced the Dimensity 9600 Pro, its next flagship smartphone chip built on a 2nm process, along with a second-tier Dimensity 9600M. The Pro succeeds the Dimensity 9500 and is aimed at premium phones.
The CPU has eight cores in a 2+3+3 layout. Two C2-Ultra cores reach 4.55GHz, three C2-Pro cores run up to 4.35GHz, and three more C2-Pro cores go up to 3.1GHz. MediaTek claims up to 17 percent higher single-core and 15 percent higher multi-core performance than the previous generation, with 61 percent lower multi-core power use.
The chip supports LPDDR6 or LPDDR5X memory at up to 10,667 MT/s and UFS 5.0 storage. Its AI engine pairs the NPU 1090, which can run local language models up to 30 billion parameters, with a Super Efficient NPU 2.0 for always-on tasks. The Arm Mali-G2 Ultra GPU is claimed to deliver 27 percent higher peak performance and 18 percent better ray tracing.
Connectivity includes Wi-Fi 7 up to 7.3Gbps, Bluetooth 6.2 and a Release 17 5G modem. The imaging engine supports sensors up to 200MP and 8K60 video, and displays can go up to WQHD+ at 180Hz.
The Dimensity 9600M uses a 1+3+4 core layout with LPDDR5X and UFS 4.1. The OPPO Find X10 series is among the first to use the new silicon, and an India launch for the Find X10 Pro Max is tipped for late October.
